Quote: Originally Posted by
galvitron 
Are you replying to me? I have the LS-372, not the LV-372.
I only have dimensions without the heatsink/fans. But, you can't really take them off unless you have some VERY effective alternate solution.
W: 5.75" x D: 4.0" x H: ? (W: 146 mm x D: 102 mm x H: 16.56 mm)
You should be able to find the specs in their downloadable manuals.
@Galvitron, Sorry, yes I should have refered to you, or mrbean_phillip, in my original post as I noticed you had both built projects around the LS-372.
I'm trying to build a project that has a depth limitation and most of the manufacturers don't appear to worry too much about depth. The figures you provided above are in the LS-372 manual but the depth figure only measures the circuit board to top of edge connector depth. There is not reference to the clearance required on the solder side (I noticed that the compact flash socket is on that side of the board). In addition, the heat sink on the GM965 looks pretty high in the pictures of your G5 project (again, no mention of this mechanical specification by the manufacturers).
If the compact flash doesn't add too much depth (or I can easily remove it as I don't need it) then I'll happily remove the heat sink for both the GM965 and Processor. I intend to provide heat transfer using a heat spreader, pipes and a fan not mounted directly on the processor.
I'm also now worried about the power consumption of this device. Global American mention a typical power consumption of 79W with the T7700. I was going to use the T7500 but that power consumption seems very high. The other 965 board they offer appears to have half the power consumption (a AZURE Mercury 965?) but no DVI or HDTV output. If the LS-372 doesn't pull that much power unless using the DVI or HDMI then I'll be happy.
Again, any help greatly appreciated and sorry if I'm hijacking this thread. Happy to move this dicussion elsewhere.